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... Example: PCB Carrier Frame The objective in this project was the development and manufacture of a grid frame to support a PCB on one side and an aluminum substrate on the other side. The insert molding features 5 stamped grids, overmolded in 2 layers. The "under the hood" component is used in an ECU housing and is exposed to temperatures up to 135° C. Intensa was in charge of the complete project management including product engineering, prototyping, tooling up to approval. The PCB Carrier Frame features terminals in OFE-Cu and CuSn6 alloys with 0,50 mm and 0,80 mm metal thickness some of them stamped from pre-tinned coil, others post-tinned shear edges as well after stamping. Due to the temparature environment and the solder temperature during further processing of the part, a heat stabilized glass fiber reinforced PA66 grade was specified. |
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Utilized Modules: Sales/Purchasing, CAD-Engineering, Prototyping Manufacturing Support and Metrology Lab |
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